3M™ Anisotropic Conductive Film Adhesive 7303, 2.5 mm x 35 m Roll, 50 Rolls per Case
Hisco #:00051115524868-31196
MFG #:7000027563
Item must be ordered in multiples of 50
| Quantity | Price | Save |
|---|---|---|
| 150 | 325.68 | Save |
3M™ ACF 7303 is an epoxy/acrylate-blend adhesive system filled with 43 micron silver-coated glass beads. It is slightly tacky at room temperature and cures at modest bonding temperature and pressure.
The unbonded film is slightly tacky at room temperature and consists of a thermoset-elastomer and thermoplastic adhesive matrix randomly loaded with conductive particles. These particles allow interconnection of circuit lines through the adhesive thickness, but are spaced far enough apart for the product to be electrically insulating in the plane of the adhesive. Soft conductive particles are preferred when bonding to fragile substrates such as ITO on glass, as they deform against hard surfaces, but may also be used for other substrate types. 3M™ ACF 7379 may be used to bond a flexible printed circuit to glass-based devices such as displays or to another flexible printed circuit. Standard Lead Time: 14 Calendar Days
3M 7000027563 Features:- Heat cure
- Thermo-set low temperature cure
- Tacky at room temperature
- Good thermal stability
- Reworkable
- Frozen storage
- Material: Epoxy
- Material Type: Conductive
- Package Quantity: 1 LOOS
- Part Number: 7303
Product Description
3M™ ACF 7303 is an epoxy/acrylate-blend adhesive system filled with 43 micron silver-coated glass beads. It is slightly tacky at room temperature and cures at modest bonding temperature and pressure.
The unbonded film is slightly tacky at room temperature and consists of a thermoset-elastomer and thermoplastic adhesive matrix randomly loaded with conductive particles. These particles allow interconnection of circuit lines through the adhesive thickness, but are spaced far enough apart for the product to be electrically insulating in the plane of the adhesive. Soft conductive particles are preferred when bonding to fragile substrates such as ITO on glass, as they deform against hard surfaces, but may also be used for other substrate types. 3M™ ACF 7379 may be used to bond a flexible printed circuit to glass-based devices such as displays or to another flexible printed circuit. Standard Lead Time: 14 Calendar Days
3M 7000027563 Features:- Heat cure
- Thermo-set low temperature cure
- Tacky at room temperature
- Good thermal stability
- Reworkable
- Frozen storage
- Material: Epoxy
- Material Type: Conductive
- Package Quantity: 1 LOOS
- Part Number: 7303
Technical Information
Item must be ordered in multiples of 50