ALPHA Capillary Underfill, CU13-3150, Thermal Cure, EFD Syringe, 33 Gram, 30CC
Hisco #:249742-0033GM-1998
MFG #:249742.0033GM
Available to Order - 0 on Hand
Manufacturer Estimated Lead Time When Not In Stock: 7 days
Minimum Order QTY: 12
Item must be ordered in multiples of 12
Item must be ordered in multiples of 12
The ALPHA 249742.0033GM is a one-component, low temperature thermal cure capillary underfill designed for low temperature applications requiring enhanced mechanical strength for chip packages assembled onto printed circuit boards.
ALPHA 249742.0033GM Features:- Low temperature thermal cure underfill
- Low Viscosity due to no filler
- Fast Cure at Low Temperatures
- Excellent adhesion and Drop Shock performance
- Anhydride Free
- NON-REWORKABLE
Product Description
Technical Information
SDS/TDS
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Product Description
WARNING: Cancer and Reproductive Harm - www.P65Warnings.ca.gov
The ALPHA 249742.0033GM is a one-component, low temperature thermal cure capillary underfill designed for low temperature applications requiring enhanced mechanical strength for chip packages assembled onto printed circuit boards.
ALPHA 249742.0033GM Features:- Low temperature thermal cure underfill
- Low Viscosity due to no filler
- Fast Cure at Low Temperatures
- Excellent adhesion and Drop Shock performance
- Anhydride Free
- NON-REWORKABLE
Technical Information
Brand: Alpha
Country Of Origin: KR
Harmonized Code: 3506.10.5000
Available to Order - 0 on Hand
Minimum Order QTY: 12
Item must be ordered in multiples of 12
Item must be ordered in multiples of 12