ALPHA NR-330 VOC-Free No-Clean Solder Flux, 5 Gallon Pail
Hisco #:129736-0005-1998
MFG #:NR-330
Our Price: $226.55 Pail-PA
Available to Order - 0 on Hand
Manufacturer Estimated Lead Time When Not In Stock: 28 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1
| Quantity | Price | Save |
|---|---|---|
| 1 | 226.55 | |
| 3 | 222.20 | Save |
The ALPHA NR-330 is a liquid no-clean flux that comes in a 5 gal pail. It provides good wetting and hole-fills with OSP-coated, bare copper boards.
ALPHA NR-330 Features:- Product Type: No-Clean Flux
- Physical Form: Liquid
- Chemical Composition: Rosin99.3sn/0.7cu and 96.5sn/3.5ag
- Shelf Life: 18month
- Applications: Soldering
- Container Type: Pail
- Capacity: 5gal
- Bellcore compliant for assemblies requiring this standard,
- VOC-free to help meet air quality regulations,
- Exceptional wetting for excellent hole-fill even with organically coated bare copper boards, with prior reflows,
- Thermally stable activators provide low solder bridging,
- Reduces the surface tension between solder mask and solder to provide low solder ball frequency,
- Very low level of non-tacky residue to reduce interference with pin testing and good board cosmetics,
- Suitable for use with lead-free alloys such as 99.3Sn/0.7Cu and 96.5Sn/3.5Ag
Product Description
Technical Information
SDS/TDS
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Product Description
The ALPHA NR-330 is a liquid no-clean flux that comes in a 5 gal pail. It provides good wetting and hole-fills with OSP-coated, bare copper boards.
ALPHA NR-330 Features:- Product Type: No-Clean Flux
- Physical Form: Liquid
- Chemical Composition: Rosin99.3sn/0.7cu and 96.5sn/3.5ag
- Shelf Life: 18month
- Applications: Soldering
- Container Type: Pail
- Capacity: 5gal
- Bellcore compliant for assemblies requiring this standard,
- VOC-free to help meet air quality regulations,
- Exceptional wetting for excellent hole-fill even with organically coated bare copper boards, with prior reflows,
- Thermally stable activators provide low solder bridging,
- Reduces the surface tension between solder mask and solder to provide low solder ball frequency,
- Very low level of non-tacky residue to reduce interference with pin testing and good board cosmetics,
- Suitable for use with lead-free alloys such as 99.3Sn/0.7Cu and 96.5Sn/3.5Ag
Technical Information
Brand: Alpha
Weight: 45
Country Of Origin: MX
Harmonized Code: 3810.90.5000
UPC Code: No UPC
Additional Resources
Our Price: $226.55 Pail-PA
Available to Order - 0 on Hand
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1