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EF-2210 VOC-Free No-Clean Solder Flux, 5 Gallon Pail

Hisco #:150996-0005-1998

MFG #:150996-0005

This item has a required storage/handling temperature range outside of ambient. Please review the TDS for more information.
WARNING: Cancer and Reproductive Harm - www.P65Warnings.ca.gov
Our Price: $216.30 Pail-PA
Available to Order - 0 on Hand
Manufacturer Estimated Lead Time When Not In Stock29 days
Minimum Order QTY: 5
Item must be ordered in multiples of 5

The ALPHA 150996-0005 is a no-clean flux that comes in a 5 gal pail. It provides good wetting and hole-fills for OSP-coated, bare copper boards.

ALPHA 150996-0005 Features:
  • Product Type: No-Clean Flux
  • Chemical Composition: Rosin
  • Applications: Soldering
  • Container Type: Pail
  • Capacity: 5gal
ALPHA 150996-0005 Specifications:
  • Bellcore SIR compliant for assemblies requiring this standard,
  • VOC-Free to help meet air quality regulations,
  • Exceptional wetting for excellent hole-fill even with OSP coated bare copper boards, with prior reflows,
  • Thermally stable activators provide low solder bridging,
  • Reduces the surface tension between solder mask and solder to provide low solder ball frequency,
  • Suitable for selective soldering process,
  • Excellent cosmetics. Very low level non-tacky residue to reduce interference with pin testing and good board cosmetics,
  • Performs well in either tin lead or lead-free processes

Product Description

WARNING: Cancer and Reproductive Harm - www.P65Warnings.ca.gov
WARNING: Cancer and Reproductive Harm - www.P65Warnings.ca.gov

The ALPHA 150996-0005 is a no-clean flux that comes in a 5 gal pail. It provides good wetting and hole-fills for OSP-coated, bare copper boards.

ALPHA 150996-0005 Features:
  • Product Type: No-Clean Flux
  • Chemical Composition: Rosin
  • Applications: Soldering
  • Container Type: Pail
  • Capacity: 5gal
ALPHA 150996-0005 Specifications:
  • Bellcore SIR compliant for assemblies requiring this standard,
  • VOC-Free to help meet air quality regulations,
  • Exceptional wetting for excellent hole-fill even with OSP coated bare copper boards, with prior reflows,
  • Thermally stable activators provide low solder bridging,
  • Reduces the surface tension between solder mask and solder to provide low solder ball frequency,
  • Suitable for selective soldering process,
  • Excellent cosmetics. Very low level non-tacky residue to reduce interference with pin testing and good board cosmetics,
  • Performs well in either tin lead or lead-free processes

Technical Information

BrandAlpha
Weight: 45.099999999999994
Country Of Origin: MX
Harmonized Code: 3810.90.5000
UPC Code: No UPC
Our Price: $216.30 Pail-PA
Available to Order - 0 on Hand
 
Minimum Order QTY: 5
Item must be ordered in multiples of 5
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