Cho-Bond
Chomeric Cond Epoxy 3g Syringe Kits
Hisco #:50-30-0584-0029-5200
MFG #:50-30-0584-0029
Our Price: $703.80 Case-CA
Available to Order - 0 on Hand
Manufacturer Estimated Lead Time When Not In Stock: 42 days
Minimum Order QTY: 4
Item must be ordered in multiples of 4
Item must be ordered in multiples of 4
| Quantity | Price | Save |
|---|---|---|
| 12 | 683.20 | Save |
The Cho-Bond 50-30-0584-0029 is a Series 584-29 epoxy adhesive with a mix ratio of 100:6.3.
The Cho-Bond 50-30-0584-0029 Features:- Two Component
- Silver filler
- Low VOC's
- Thin Paste
- Minimal Shrinkage
- Fast heat cure, increase throughput, minimize equipment downtime
- Excellent conductivity 0.002 ohm-cm
- Very small needle, fill small cracks and voids
- Brand: CHO-BOND®
- Series: 584-29
- Product Type: Epoxy Adhesive
- Hardness: 80Shore D
- Color: Silver
- Primary Color: Silver
- Mix Ratio: 100:6.3
- Physical Form: Paste
- Cure Time: 24h
- Shelf Life: 12month
- Specific Gravity: 2.5
- VOCs Content: 3g/L
- Cure Type: Room Temperature
- Maximum Operating Temperature: +257°F
- Minimum Operating Temperature: -67°F
- Container Capacity: 3g
- Container Type: Kit
- Applications: Bonding and Grounding Of Electrical Components, Cold Soldering and Sealing Machined Enclosures
Product Description
Technical Information
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Product Description
The Cho-Bond 50-30-0584-0029 is a Series 584-29 epoxy adhesive with a mix ratio of 100:6.3.
The Cho-Bond 50-30-0584-0029 Features:- Two Component
- Silver filler
- Low VOC's
- Thin Paste
- Minimal Shrinkage
- Fast heat cure, increase throughput, minimize equipment downtime
- Excellent conductivity 0.002 ohm-cm
- Very small needle, fill small cracks and voids
- Brand: CHO-BOND®
- Series: 584-29
- Product Type: Epoxy Adhesive
- Hardness: 80Shore D
- Color: Silver
- Primary Color: Silver
- Mix Ratio: 100:6.3
- Physical Form: Paste
- Cure Time: 24h
- Shelf Life: 12month
- Specific Gravity: 2.5
- VOCs Content: 3g/L
- Cure Type: Room Temperature
- Maximum Operating Temperature: +257°F
- Minimum Operating Temperature: -67°F
- Container Capacity: 3g
- Container Type: Kit
- Applications: Bonding and Grounding Of Electrical Components, Cold Soldering and Sealing Machined Enclosures
Technical Information
Brand: Cho-Bond
Weight: 0.1
Country Of Origin: US
Our Price: $703.80 Case-CA
Available to Order - 0 on Hand
Minimum Order QTY: 4
Item must be ordered in multiples of 4
Item must be ordered in multiples of 4