
HP-250 High Performance Chemical Resistant Structural Adhesive Epoxy, 400mL Cartridge
Hisco #:14415-38794
MFG #:14415
Item must be ordered in multiples of 12
| Quantity | Price | Save |
|---|---|---|
| 36 | 104.12 | Save |
This item is hazardous and may be subject to an additional handling fee.
The Devcon 14415 amber epoxy adhesive that comes in a 50ml cartridge. It is used for room-temperature structural bonding applications.
Features:
- Hardness: 78Shore D
- Material Compatibility: Plastic
- Viscosity Measurement: 105000cP
- Chemical Composition: Aminoethylpiperazine, Nonylphenol, Amorphous Silicon Dioxide, Butadiene Acrylonitrile Copolymer, 4,4'-Methylenebiscyclohexanamine, Pacm Oligomers, Triethylene Glycol Diamine
- Peel Strength: 35 t0 40pli
- Cure Type: Room 75°F
- Dielectric Strength: 490V/mil
- Applications: Bonding, Potting, Encapsulating
Prop 65 Notice: This product can expose you to chemicals including lead and lead compound, which are known to the State of California to cause cancer and birth defects or other reproductive harm.
Product Description
This item is hazardous and may be subject to an additional handling fee.
The Devcon 14415 amber epoxy adhesive that comes in a 50ml cartridge. It is used for room-temperature structural bonding applications.
Features:
- Hardness: 78Shore D
- Material Compatibility: Plastic
- Viscosity Measurement: 105000cP
- Chemical Composition: Aminoethylpiperazine, Nonylphenol, Amorphous Silicon Dioxide, Butadiene Acrylonitrile Copolymer, 4,4'-Methylenebiscyclohexanamine, Pacm Oligomers, Triethylene Glycol Diamine
- Peel Strength: 35 t0 40pli
- Cure Type: Room 75°F
- Dielectric Strength: 490V/mil
- Applications: Bonding, Potting, Encapsulating
Prop 65 Notice: This product can expose you to chemicals including lead and lead compound, which are known to the State of California to cause cancer and birth defects or other reproductive harm.
Technical Information
Item must be ordered in multiples of 12

