HM531 Series Halide-Free Solder Paste, Type 3, Sn63Pb37, 500g Jar
Hisco #:70-1002-0510-16600
MFG #:70-1002-0510
Our Price: $114.02 Jar-JR
Available to Order - 0 on Hand
Manufacturer Estimated Lead Time When Not In Stock: 17 days
Minimum Order QTY: 10
Item must be ordered in multiples of 10
Item must be ordered in multiples of 10
| Quantity | Price | Save |
|---|---|---|
| 30 | 108.47 | Save |
The Kester 70-1002-0510 is a Series HM531 water-soluble solder paste .
The Kester 70-1002-0510 Features:- Outstanding batch-to-batch consistency
- Excellent anti-slump characteristics minimizing bridging defects
- Capable of 60+ minute idle times in printing
- Capable of print speeds up to 150mm/sec (6in/sec)
- Excellent solderability to difficult lead-free metalizations with a leaded paste
- Residues easily removed with hot DI water, even up to 48 hours after soldering
- Minimal foam in wash systems
- 8+ hour stencil life
- Classified as ORM0 per J-STD-004
- Produces minimal voiding
- underneath BGA components
- Compatible with enclosed print head systems
- Brand: Kester®
- Series: HM531
- Product Type: Water-Soluble Solder Paste
- Physical Form: Paste
- Chemical Composition: Sn63Pb37
- Odor: Mild
- Applications: Soldering
- Standards Met: Classified as ORM0 per J-STD-004, J-STD-005, IPC-TM-650
- Container Type: Jar
- Capacity: 500g
Product Description
Technical Information
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Product Description
WARNING: Cancer and Reproductive Harm - www.P65Warnings.ca.gov
The Kester 70-1002-0510 is a Series HM531 water-soluble solder paste .
The Kester 70-1002-0510 Features:- Outstanding batch-to-batch consistency
- Excellent anti-slump characteristics minimizing bridging defects
- Capable of 60+ minute idle times in printing
- Capable of print speeds up to 150mm/sec (6in/sec)
- Excellent solderability to difficult lead-free metalizations with a leaded paste
- Residues easily removed with hot DI water, even up to 48 hours after soldering
- Minimal foam in wash systems
- 8+ hour stencil life
- Classified as ORM0 per J-STD-004
- Produces minimal voiding
- underneath BGA components
- Compatible with enclosed print head systems
- Brand: Kester®
- Series: HM531
- Product Type: Water-Soluble Solder Paste
- Physical Form: Paste
- Chemical Composition: Sn63Pb37
- Odor: Mild
- Applications: Soldering
- Standards Met: Classified as ORM0 per J-STD-004, J-STD-005, IPC-TM-650
- Container Type: Jar
- Capacity: 500g
Technical Information
Brand: Kester
Weight: 595
Country Of Origin: US
Harmonized Code: 3810.90.1000
Our Price: $114.02 Jar-JR
Available to Order - 0 on Hand
Minimum Order QTY: 10
Item must be ordered in multiples of 10
Item must be ordered in multiples of 10