Hisco #:2420246-34899
MFG #:2420246
Item must be ordered in multiples of 10
| Quantity | Price | Save |
|---|---|---|
| 30 | 525.17 | Save |
The Loctite 2420246
ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages.
Features:
- Color: Black
- Odor: Slight
- Specific Gravity: 1.68
- Flash Point: > 230°F
- VOC Content: < 1%
Product Description
The Loctite 2420246
ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages.
Features:
- Color: Black
- Odor: Slight
- Specific Gravity: 1.68
- Flash Point: > 230°F
- VOC Content: < 1%
Technical Information
Item must be ordered in multiples of 10


