US_HISCO_SPIRE

Thermal Cure Silicone System, 850G AG/CU, CHOFORM 2 Part Kit

Hisco #:19-26-5513-0850-5200

MFG #:19-26-5513-0850

Our Price: $1,968.72 KT
Available to Order - 0 on Hand
Manufacturer Estimated Lead Time When Not In Stock45 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
QuantityPriceSave
11968.72
31775.75Save

Product Description

Technical Information

BrandParker
Weight: 2.1

Additional Resources

Our Price: $1,968.72 KT
Available to Order - 0 on Hand
 
Minimum Order QTY: 1
Item must be ordered in multiples of 1
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