Shin-Etsu
Shin Etsu SES22533-60 Potting Encapsulant, Dual Component, Part B, 18kg Pail
Hisco #:SES22533-60-B-18KG
MFG #:SES22533-60-B-18KG
Our Price: $518.94 Pail-PA
Available to Order - 0 on Hand
Manufacturer Estimated Lead Time When Not In Stock: 112 days
Minimum Order QTY: 10
Item must be ordered in multiples of 10
Item must be ordered in multiples of 10
| Quantity | Price | Save |
|---|---|---|
| 30 | 501.30 | Save |
The Shin-Etsu SES22533-60-B-18KG is a dual component, room temperature cure, self leveling potting encapsulent that cures to form a durable, flexible rubber to protect electronic components. SES22533-60 A/B exhibits excellent unprimed adhesion to most circuit board substrates, metals, plastics, glass, and ceramics.
Features:
- Dual component
- 1:1 mix ratio
- Roomtemperature cure
- Self-leveling
Applications:
- Protecting and electrically isolating electronic components
- Stress reduction
Product Description
Technical Information
SDS/TDS
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Product Description
WARNING: Cancer and Reproductive Harm - www.P65Warnings.ca.gov
The Shin-Etsu SES22533-60-B-18KG is a dual component, room temperature cure, self leveling potting encapsulent that cures to form a durable, flexible rubber to protect electronic components. SES22533-60 A/B exhibits excellent unprimed adhesion to most circuit board substrates, metals, plastics, glass, and ceramics.
Features:
- Dual component
- 1:1 mix ratio
- Roomtemperature cure
- Self-leveling
Applications:
- Protecting and electrically isolating electronic components
- Stress reduction
Technical Information
Brand: Shin-Etsu
Weight: 39.672000000000004
Country Of Origin: US
Harmonized Code: 3907.30.0000
Our Price: $518.94 Pail-PA
Available to Order - 0 on Hand
Minimum Order QTY: 10
Item must be ordered in multiples of 10
Item must be ordered in multiples of 10