ABLESTIK QMI519 Silver-Filled Conductive Adhesive, Hydrophobic, 5 cc Syringe
Hisco #:500404-34899
MFG #:500404
Item must be ordered in multiples of 20
| Quantity | Price | Save |
|---|---|---|
| 60 | 151.89 | Save |
This item is hazardous and may be subject to an additional handling fee.
The Loctite 500404
ABLESTIK QMI519 silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal leadframes. It is is designed to achieve UPHs several orders of magnitude higher than conventional oven cured adhesives. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater. Studies have also shown improved coplanarity in parts cured on the diebonder.
Features:
- Color: Silver
- Odor: Mild
- Specific Gravity: 4.15
- Flash Point: > 199.4°F
- VOC Content: < 3%
Product Description
This item is hazardous and may be subject to an additional handling fee.
The Loctite 500404
ABLESTIK QMI519 silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal leadframes. It is is designed to achieve UPHs several orders of magnitude higher than conventional oven cured adhesives. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater. Studies have also shown improved coplanarity in parts cured on the diebonder.
Features:
- Color: Silver
- Odor: Mild
- Specific Gravity: 4.15
- Flash Point: > 199.4°F
- VOC Content: < 3%
Technical Information
Item must be ordered in multiples of 20