ECCOBOND E 1172 A Underfill Epoxy, 30cc Syringe
Hisco #:1189514-34899
MFG #:1189514
Item must be ordered in multiples of 10
| Quantity | Price | Save |
|---|---|---|
| 30 | 161.97 | Save |
This item is hazardous and may be subject to an additional handling fee.
The Loctite 1189514
ECCOBOND E 1172 A is formulated for use with very fine area array devices where SMT transparent processing is critical. This material can underfill devices with 25micron geometries. LOCTITE ECCOBOND E 1172 A provides a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects.
Features:
- Color: Tan
- Odor: Slight
- Specific Gravity: 1.68
- Flash Point: > 199.4°F
- VOC Content: < 0.1%
Product Description
This item is hazardous and may be subject to an additional handling fee.
The Loctite 1189514
ECCOBOND E 1172 A is formulated for use with very fine area array devices where SMT transparent processing is critical. This material can underfill devices with 25micron geometries. LOCTITE ECCOBOND E 1172 A provides a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects.
Features:
- Color: Tan
- Odor: Slight
- Specific Gravity: 1.68
- Flash Point: > 199.4°F
- VOC Content: < 0.1%
Technical Information
Additional Resources
Item must be ordered in multiples of 10