ALPHA WS-820 Solder Paste, Lead Free, Water-Soluble, SAC305, 88-3-M19, 500 Gram Jar
Hisco #:152996-1998
MFG #:WS-820
Our Price: $128.24 Jar-JR
Availability: 41 In Stock
Manufacturer Estimated Lead Time When Not In Stock: 25 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1
| Quantity | Price | Save |
|---|---|---|
| 1 | 128.24 | |
| 24 | 124.48 | Save |
| 72 | 120.93 | Save |
The ALPHA WS-820 is a Series WS-820 lead-free solder paste .
The ALPHA WS-820 Features:- Excellent print volume and print volume repeatability down to 12 mil (0.3mm) features
- Able to spread and wet using straight ramp or soak reflow profiles in air
- High spread/wetting lead free paste compatible with lead free alloys and surface finishes
- High Reflow Yield with IPC Class II Voiding performance when used to solder BGA components
- Excellent wetting characteristics on all common surface finishes (including Entek HT OSP), JIS Spread 88.6% on Entek HT OSP
- Cleanable with water based cleaning systems
- Series: WS-820
- Product Type: Lead-Free Solder Paste
- Physical Form: Paste
- Chemical Composition: Sn96.5Ag3.0Cu0.5
- Applications: Soldering
- Standards Met: IPC J-Std-004 ORH0, IPC Class II, IPC TM-650, RoHS Compliant
- Container Type: Jar
- Capacity: 500g
Product Description
Technical Information
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Product Description
WARNING: Cancer and Reproductive Harm - www.P65Warnings.ca.gov
The ALPHA WS-820 is a Series WS-820 lead-free solder paste .
The ALPHA WS-820 Features:- Excellent print volume and print volume repeatability down to 12 mil (0.3mm) features
- Able to spread and wet using straight ramp or soak reflow profiles in air
- High spread/wetting lead free paste compatible with lead free alloys and surface finishes
- High Reflow Yield with IPC Class II Voiding performance when used to solder BGA components
- Excellent wetting characteristics on all common surface finishes (including Entek HT OSP), JIS Spread 88.6% on Entek HT OSP
- Cleanable with water based cleaning systems
- Series: WS-820
- Product Type: Lead-Free Solder Paste
- Physical Form: Paste
- Chemical Composition: Sn96.5Ag3.0Cu0.5
- Applications: Soldering
- Standards Met: IPC J-Std-004 ORH0, IPC Class II, IPC TM-650, RoHS Compliant
- Container Type: Jar
- Capacity: 500g
Technical Information
Brand: Alpha
Availability: In Stock
Weight: 1
Country Of Origin: MX
Harmonized Code: 3810.10.0000
UPC Code: No UPC
Our Price: $128.24 Jar-JR
Availability: 41 In Stock
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1