ALPHA WS-820 Lead Free Water-Soluble Solder Paste, SAC305, 87.5-4-M18, 500 Gram Jar

The ALPHA WS-820 is a lead-free, halide-free solder paste. WS-820 offers the ideal combination of printability and reflow profile process window with excellent cleanability.

• Excellent print volume and print volume repeatability down to 12 mil (0.3mm) features
• Able to spread and wet using straight ramp or soak reflow profiles in air
• High spread/wetting lead free paste compatible with lead free alloys and surface finishes
• High Reflow Yield with IPC Class II Voiding performance when used to solder BGA components
• Excellent wetting characteristics on all common surface finishes (including Entek HT OSP), JIS Spread 88.6% on Entek HT OSP
• Cleanable with water based cleaning systems
  

• Series: WS-820
• Product Type: Lead-Free Solder Paste
• Physical Form: Paste
• Chemical Composition: SAC 305
• Applications: Soldering
• Standards Met: IPC J-Std-004 ORH0, IPC Class II, IPC TM-650, RoHS Compliant
• Container Type: Jar
• Capacity: 500g