ALPHA WS-820 Lead Free Water-Soluble Solder Paste, SACX0807, 87.5-4-M18, 500g Jar
Hisco #:157134-1998
MFG #:WS-820
Our Price: $98.10 Jar-JR
Available to Order - 0 on Hand
Manufacturer Estimated Lead Time When Not In Stock: 10 days
Minimum Order QTY: 24
Item must be ordered in multiples of 24
Item must be ordered in multiples of 24
| Quantity | Price | Save |
|---|---|---|
| 72 | 95.65 | Save |
The ALPHA WS-820 is a Series WS-820 lead-free solder paste .
The ALPHA WS-820 Features:- Excellent print volume and print volume repeatability down to 12 mil (0.3mm) features
- Able to spread and wet using straight ramp or soak reflow profiles in air
- High spread/wetting lead free paste compatible with lead free alloys and surface finishes
- High Reflow Yield with IPC Class II Voiding performance when used to solder BGA components
- Excellent wetting characteristics on all common surface finishes (including Entek HT OSP), JIS Spread 88.6% on Entek HT OSP
- Cleanable with water based cleaning systems
- Series: WS-820
- Product Type: Lead-Free Solder Paste
- Physical Form: Paste
- Chemical Composition: SACX PLUS 0807
- Applications: Soldering
- Standards Met: IPC J-Std-004 ORH0, IPC Class II, IPC TM-650, RoHS Compliant
- Container Type: Jar
- Capacity: 500g
Product Description
Technical Information
SDS/TDS
Back to top
Product Description
WARNING: Cancer and Reproductive Harm - www.P65Warnings.ca.gov
The ALPHA WS-820 is a Series WS-820 lead-free solder paste .
The ALPHA WS-820 Features:- Excellent print volume and print volume repeatability down to 12 mil (0.3mm) features
- Able to spread and wet using straight ramp or soak reflow profiles in air
- High spread/wetting lead free paste compatible with lead free alloys and surface finishes
- High Reflow Yield with IPC Class II Voiding performance when used to solder BGA components
- Excellent wetting characteristics on all common surface finishes (including Entek HT OSP), JIS Spread 88.6% on Entek HT OSP
- Cleanable with water based cleaning systems
- Series: WS-820
- Product Type: Lead-Free Solder Paste
- Physical Form: Paste
- Chemical Composition: SACX PLUS 0807
- Applications: Soldering
- Standards Met: IPC J-Std-004 ORH0, IPC Class II, IPC TM-650, RoHS Compliant
- Container Type: Jar
- Capacity: 500g
Technical Information
Brand: Alpha
Weight: 1
Country Of Origin: MX
Harmonized Code: 3810.10.0000
UPC Code: No UPC
Additional Resources
Our Price: $98.10 Jar-JR
Available to Order - 0 on Hand
Minimum Order QTY: 24
Item must be ordered in multiples of 24
Item must be ordered in multiples of 24