ALPHA Capillary Underfill, CU13-3150, Thermal Cure, EFD Syringe, 5 Gram, 10CC
Hisco #:249742-0005GM-1998
MFG #:249742.0005GM
Available to Order - 0 on Hand
Manufacturer Estimated Lead Time When Not In Stock: 55 days
Minimum Order QTY: 33
Item must be ordered in multiples of 33
Item must be ordered in multiples of 33
The ALPHA 249742.0005GM is a one-component, low temperature thermal cure capillary underfill designed for low temperature applications requiring enhanced mechanical strength for chip packages assembled onto printed circuit boards.
ALPHA 249742.0005GM Features:- Low temperature thermal cure underfill
- Low Viscosity due to no filler
- Fast Cure at Low Temperatures
- Excellent adhesion and Drop Shock performance
- Anhydride Free
- NON-REWORKABLE
Product Description
Technical Information
SDS/TDS
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Product Description
WARNING: Cancer and Reproductive Harm - www.P65Warnings.ca.gov
The ALPHA 249742.0005GM is a one-component, low temperature thermal cure capillary underfill designed for low temperature applications requiring enhanced mechanical strength for chip packages assembled onto printed circuit boards.
ALPHA 249742.0005GM Features:- Low temperature thermal cure underfill
- Low Viscosity due to no filler
- Fast Cure at Low Temperatures
- Excellent adhesion and Drop Shock performance
- Anhydride Free
- NON-REWORKABLE
Technical Information
Brand: Alpha
Country Of Origin: KR
Harmonized Code: 3506.10.5000
Available to Order - 0 on Hand
Minimum Order QTY: 33
Item must be ordered in multiples of 33
Item must be ordered in multiples of 33