ALPHA CNP OM-362 T4 SAC305 Solder Paste, 500g Jar
Hisco #:281352-1998
MFG #:OM-362
Manufacturer Estimated Lead Time When Not In Stock: 19 days
Item must be ordered in multiples of 24
| Quantity | Price | Save |
|---|---|---|
| 72 | 130.00 | Save |
The ALPHA OM-362 is a lead-free, zero-halogen, no-clean solder paste available in T4 powder. It is designed to provide ultra-low voiding performance on all component types, especially bottom terminated components. ALPHA OM-362 achieves IPC Class III voiding on BGA components, and less than 10% average voiding on Bottom Terminated Components (BTC). This paste is designed for ultra-low voiding performance with high reliability alloys such as Innolot as well as traditional SAC alloys.
ALPHA OM-362 Features:- Ultra-Low voiding performance
- Excellent electromigration characteristics
- Good coalescence and wetting performance
- Brand: Alpha
- Series: OM-362
- Alloy Type: SAC305
Product Description
The ALPHA OM-362 is a lead-free, zero-halogen, no-clean solder paste available in T4 powder. It is designed to provide ultra-low voiding performance on all component types, especially bottom terminated components. ALPHA OM-362 achieves IPC Class III voiding on BGA components, and less than 10% average voiding on Bottom Terminated Components (BTC). This paste is designed for ultra-low voiding performance with high reliability alloys such as Innolot as well as traditional SAC alloys.
ALPHA OM-362 Features:- Ultra-Low voiding performance
- Excellent electromigration characteristics
- Good coalescence and wetting performance
- Brand: Alpha
- Series: OM-362
- Alloy Type: SAC305
Technical Information
Item must be ordered in multiples of 24