TF 1800 BGA and SMD Total Rework System, 120V

The PACE 8007-0574 provides ultimate thermal performance by its ability to instantly heat up and cool down the temperature of the air it delivers to the work for safe, rapid solder joint reflow in virtually any component installation or removal application.

PACE 8007-0574 Features:

• Low thermal mass heater provides quick response heat-up and cool down
• Requires far less power to operate
• Motor system provides smooth, high precision, repeatable movement with no drift
• Provides ultimate thermal performance by its ability to instantly heat up and cool down the air temperature
• Adjustable height bottom-side IR preheater
• Board support wand for easy adjustment
• Automated vision overlay systems uses a beam-splitting prism for simultaneous view of PCB pads and balls
• High intensity

PACE 8007-0574 Specifications:

• Power requirements: 120 VAC
• Dimensions: 29 x 27 x 29"
• Weight: 100lbs
• Top-side heater: Inductive-convection heater, 300 Watts
• Bottom-side preheater: Medium/long wave IR, 1000 Watts
• Temperature range setting: 100° to 400°C (212° - 750°F)
• Maximum/minimum PCB size: 12 x 12"
• Maximum/minimum component size: 2.5 x 2.5"
• Thermocouple inputs: 4
• Auxillary cooling fan: Standard
• Video input: USB 3.0
• Maximum airflow: Self-containted pump 30 SLPM
• Warranty: 1 year limited warranty