
Thermally Conductive Flowable Adhesive, Fast Cure. 25mL Dual Syringe
Hisco #:8329TFF-25ML-33018
MFG #:8329TFF-25ML
Item must be ordered in multiples of 1
| Quantity | Price | Save |
|---|---|---|
| 1 | 34.89 | |
| 6 | 33.87 | Save |
| 18 | 32.90 | Save |
The MG Chemicals 8329TFF-25ML is a thermally conductive, fast-cure two-part epoxy adhesive. It is off-white, smooth, thixotropic, and bonds well to a wide variety of substances. It is also flame retardant, and meets the UL 94V-0 standard. For a 1 mL quantity, a minimal service cure can be achieved in 15 minutes at room temperature, and a full cure in 4 hours.This product is used to bond heat sinks, LEDs and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips and automatic dispensing systems.For a longer working life, use 8329TFM or 8329TFS.
MG Chemicals 8329TFF-25ML Features:- Thermal conductivity of 0.8 W/(m·K)
- 1:1 mix ratio
- Working life: 4 minutes
- Set time: 15 minutes
- Cure time: 4 hours at room temperature or 15 minutes at 65 °C (149 °F)
- Flame retardant—meets UL 94V-0 standard
- Provides strong electrical insulation
- Low CTE prior Tg
- High tensile and compressive strength
- Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons
- Shelf life: ≥3 years
- RoHS 3 compliant
- Container size: 25mL Dual Syringe
- Working life @22 °C [72 °F]: 4 min
- Shelf life @22 °C [72 °F] a) : ≥3 y
- Set time @22 °C [72 °F]: 15 min
- Full cure @22 °C [72 °F]: 4 h
- Full cure @65 °C [149 °F]: 15 min
- Full cure @80 °C [176 °F] :10 min
- Constant service temperature: -40 to 150 °C [-40 to 302 °F]
- Maximum intermittent temperature: 175 °C [347 °F]
- Storage temperature: 22 to 27 °C [72 to 81 °F]
Product Description
The MG Chemicals 8329TFF-25ML is a thermally conductive, fast-cure two-part epoxy adhesive. It is off-white, smooth, thixotropic, and bonds well to a wide variety of substances. It is also flame retardant, and meets the UL 94V-0 standard. For a 1 mL quantity, a minimal service cure can be achieved in 15 minutes at room temperature, and a full cure in 4 hours.This product is used to bond heat sinks, LEDs and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips and automatic dispensing systems.For a longer working life, use 8329TFM or 8329TFS.
MG Chemicals 8329TFF-25ML Features:- Thermal conductivity of 0.8 W/(m·K)
- 1:1 mix ratio
- Working life: 4 minutes
- Set time: 15 minutes
- Cure time: 4 hours at room temperature or 15 minutes at 65 °C (149 °F)
- Flame retardant—meets UL 94V-0 standard
- Provides strong electrical insulation
- Low CTE prior Tg
- High tensile and compressive strength
- Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons
- Shelf life: ≥3 years
- RoHS 3 compliant
- Container size: 25mL Dual Syringe
- Working life @22 °C [72 °F]: 4 min
- Shelf life @22 °C [72 °F] a) : ≥3 y
- Set time @22 °C [72 °F]: 15 min
- Full cure @22 °C [72 °F]: 4 h
- Full cure @65 °C [149 °F]: 15 min
- Full cure @80 °C [176 °F] :10 min
- Constant service temperature: -40 to 150 °C [-40 to 302 °F]
- Maximum intermittent temperature: 175 °C [347 °F]
- Storage temperature: 22 to 27 °C [72 to 81 °F]
Technical Information
Item must be ordered in multiples of 1

